| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX17047G+T10 | IC |
MAXIM/美信 |
TQFN10 |
21+ |
8600 |
|||
| W9751G6KB-25 | DDR存储器 |
WINBOND/华邦 |
FBGA84 |
11+14+16+17+ |
198 |
|||
| STM32F105RBT6 | ST/意法 |
LQFP-64 |
21+ |
42 |
||||
| SDINBDG4-16G | 存储IC |
SANDISK/闪迪 |
BGA |
14+ |
15 |
|||
| MAX96718AGTM/VY+T | MAXIM/美信 |
QFN48 |
19+ |
25 |
||||
| MAX96712GTB/V | MAXIM/美信 |
QFN |
21+ |
50 |
||||
| IS62WV10248EBLL-45TLI | 存储IC |
ISSI/芯成 |
TSOP-44 |
18+ |
14 |
|||
| DM9000AEP | 接口IC |
DAVICOM |
LQFP-48 |
15+ |
111 |
|||
| MC9S08AW60CPUE | 其他被动元件 |
NXP/恩智浦 |
LQFP-64 |
18+ |
153 |
|||
| XT26G02ELGIGA | XTX/芯天下 |
LGA-8 |
20+ |
45 |
||||
| ATSAMG55J19A-AU | IC |
MICROCHIP/微芯 |
LQFP-64 |
18+ |
10222 |
|||
| ADP7112ACBZ-1.2-R7 | IC |
ADI/亚德诺 |
WLCSP-6 |
22+ |
8888 |
|||
| ZED-F9P-01B | IC |
U-BLOX |
GPS |
21+ |
50 |
|||
| MAX25302BATD/V+T | MAXIM/美信 |
TDFN-14 |
22+ |
623 |
||||
| K4H561638J-LCCC | 内存芯片 |
SAMSUNG/三星 |
TSOP-66 |
15+ |
111 |
|||
| MPI12X | PROFICHIP |
QFP-44 |
21+ |
40 |
||||
| AM4377BZDND100 | 单片机MCU |
TI/德州仪器 |
BGA-491 |
17+ |
90 |
|||
| MIC5365-3.3YC5-TR | 电源IC |
MICROCHIP/微芯 |
SC70-5 |
22+ |
48220 |
|||
| MC908AP32CFAE | 8位MCU |
FREESCALE/飞思卡尔 |
QFP |
14+ |
229 |
|||
| HI3536DRBCV100 | 存储IC |
HISILICON/海思 |
BGA |
19+20+21+ |
65 |
商家默认展示20条库存